Keba Kemro K2 - Page 10

4.52 Production settings - Tab2.................................................................................. 131
4.52.1 Purpose................................................................................................ 131
4.52.2 Description of the mask........................................................................ 131
4.52.3 Description of the elements.................................................................. 132
4.53 Production settings - Tab3.................................................................................. 132
4.53.1 Purpose................................................................................................ 132
4.53.2 Description of the mask........................................................................ 132
4.53.3 Description of the elements.................................................................. 132
4.54 Mold data............................................................................................................ 133
4.54.1 Purpose................................................................................................ 133
4.54.2 Description of the mask........................................................................ 133
4.54.3 Description of the elements.................................................................. 134
4.55 Export.................................................................................................................. 135
4.55.1 Purpose................................................................................................ 135
4.55.2 Description of the mask........................................................................ 135
4.55.3 Description of the elements.................................................................. 135
4.56 Energy Monitor.................................................................................................... 136
4.56.1 Purpose................................................................................................ 136
4.56.2 Description of the mask........................................................................ 136
4.56.3 Description of the elements.................................................................. 137
4.57 Energy Chart (by shot)........................................................................................ 137
4.57.1 Purpose................................................................................................ 137
4.57.2 Description of the mask........................................................................ 137
4.57.3 Description of the elements.................................................................. 138
4.58 Energy Chart (by time)........................................................................................ 139
4.58.1 Purpose................................................................................................ 139
4.58.2 Description of the mask........................................................................ 139
4.58.3 Description of the elements.................................................................. 140
4.59 Flex IO Mask....................................................................................................... 140
4.59.1 Purpose................................................................................................ 140
4.59.2 Description of the mask........................................................................ 140
4.59.3 Description of the elements.................................................................. 141
4.60 Flex IO SystemVariables..................................................................................... 142
4.60.1 Purpose................................................................................................ 142
4.60.2 Description of the mask........................................................................ 142
4.60.3 Description of the elements.................................................................. 143
4.61 Process data protocol (PDP)............................................................................... 143
4.61.1 Purpose................................................................................................ 143
4.61.2 Description of the mask........................................................................ 143
4.61.3 Description of the elements.................................................................. 144
4.62 Statistical Process Control (SPC)....................................................................... 145
4.62.1 Purpose................................................................................................ 145
4.62.2 Description of the mask........................................................................ 145
4.62.3 Description of the elements.................................................................. 146
4.63 SPC Settings....................................................................................................... 147
4.63.1 Purpose................................................................................................ 147
4.63.2 Description of the mask........................................................................ 147
4.63.3 Description of the elements.................................................................. 148
4.64 SPC Variable Setup............................................................................................ 148
Table of Contents
KePlast.HMI.KVB
© KEBA 2016
User's manual V3.0510