DLP-514: Detailed Level Procedure 365-575-102
Page2of4 Issue8.0,July2002
4. Remove the optical fiber from the slot guide on the shelf. This is to prevent
damage to the fiber when the circuit pack is removed.
5. If required, remove the LBOs from the connector(s) on the OC-3, IS-3, OC-12,
RCVR, TRMTR, or REGENR circuit pack.
Reference: DLP-512
6. Is the circuit pack a low speed interface (DS3 or STS1E)?
If YES, then continue with Step 7.
If NO, then continue with Step 10.
7.
NOTE:
For DS3 and STS1E circuit packs only: A verification of either an
automatic or a CIT provisioned protection switch is made before
removing the low speed circuit pack from the shelf.
At the CIT, select FAULT-Retrieve-State:LS INTFC command and
obtain a State Report on the circuit pack being replaced.
8. From the report, is the low speed slot (circuit pack to be removed) in a standby
state?
If YES, then continue with Step 14.
If NO, then continue with Step 9.
9. At the CIT, select FAULT-Switch-Low Speed:Slot command for the circuit
pack being removed and execute. Use the FAULT-Retrieve-State:LS
INTFC command to verify, if desired.
10. Is the circuit pack a TG3 circuit pack?
If YES, then continue with Step 11.
If NO, then continue with Step 14.
11. NOTE:
For TG3 circuit packs only: A verification of a CIT provisioned (manual)
protection switch is made before removing the TG3 circuit pack from the shelf.
At the CIT, select FAULT-Retrieve-State:TG command and obtain a State
Report on the circuit pack being replaced.
12. From the report, is the TG3 circuit pack to be removed in a standby state with
a manual switch?
If YES, then continue with Step 14.
If NO, then continue with Step 13.
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