Operations and Maintenance Manual Operator Functions
Version 1.2 - June 2004 8 - 23
EVENT SEQUENCE
1. The operator rotates the turrets to position the cassettes for pickup and delivery by the
wafer handling robot.
2. The robot scans the first available send cassette and displays the number of wafers in
the cassette on that cassette’s corresponding screen icon.
3. The robot scans the first available receive cassette and displays the number of wafers
in the cassette on that cassette’s corresponding screen icon.
4. The robot removes the first available wafer (Wafer #1) from the first available send
cassette, flips the wafer, and places it on the pre-aligner.
5. The pre-aligner centers the wafer and locates the flat (if one is present).
6. While events 1 through 5 are taking place, the right work chuck is being conditioned,
and the right probe is referencing.
7. The robot then removes the wafer from the pre-aligner and places it on the right work
chuck.
8. While the bridge moves to the right position and begins to coarse grind the first wafer,
the robot removes the next available wafer (Wafer #2) from the send cassette, flips it,
and places it on the pre-aligner.
9. At this time, the left work chuck is being conditioned, and the left probe is referencing.
10. When conditioning of the left work chuck and referencing of the left probe have been
completed, the robot moves the wafer (Wafer #2) from the pre-aligner to the left work
chuck.
11. The bridge moves to the center position and begins to coarse grind the second wafer
while fine grinding the first wafer (Wafer #1).
12. The robot moves the next available wafer (Wafer #3) from the send cassette to the pre-
aligner.
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