Strasbaugh nTellect (Model 7AF) Wafer Grinder
8 - 24 Version 1.2 - June 2004
13. The bridge moves to the left position and begins to fine grind the second wafer while
the robot removes the first wafer (Wafer #1) from the load chuck and places it on the
spin/rinse station.
14. The spin/rinse station cleans and dries the first wafer.
15. The robot repeats the loading procedure of moving the next available wafer (Wafer
#4) from the send cassette to the pre-aligner.
16. When the wafer (Wafer #1) on the spin/rinse station is ready, the robot moves it to the
first available slot of receive cassette.
17. The robot then moves the wafer (Wafer #2) from the left work chuck to the spin/rinse
station.
18. The wafer (Wafer #2) on the spin/rinse station is cleaned and dried.
19. The loading, centering, grinding, cleaning and drying, and storing of wafers, as well as
the accompanying events of conditioning and probe referencing, continue to be
repeated until all available wafers have been processed.
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