Strasbaugh nTellect 7AF - Page 223

Operations and Maintenance Manual Machine Setup
Version 1.2 - June 2004 9 - 11
The chart below depicts a partial representation of the Wafer Recipes menu with
definitions for the values to be entered in the cells.
GRIND STEPS
PARAMETERS
Step 1 Step 2 Step 3 Dwell Lift
value entered =
wafer thickness
obtained upon
completion of
the first
grinding
segment
value entered =
wafer thickness
obtained upon
completion of
the second
grinding
segment
value entered =
wafer thickness
obtained upon
completion of
the third
grinding
segment
value entered =
target height (in
microns) to
which the grind
wheel is to rise
during the lift
segment
THICKNESS
(in microns)
(revs)
value entered =
number of
work chuck
revolutions with
the wheel height
unchanged
value entered =
rate of grind
wheel height
change during
the first
grinding
segment
value entered =
rate of grind
wheel height
change during
the second
grinding
segment
value entered =
rate of grind
wheel height
change during
the third
grinding
segment
value entered =
rate of grind
wheel height
change during
the lift segment
FEED RATE
(in microns
per second)
value entered =
speed of the
work chuck
during the first
grinding
segment
value entered =
speed of the
work chuck
during the
second grinding
segment
value entered =
speed of the
work chuck
during the third
grinding
segment
value entered =
speed of the
work chuck
during the dwell
segment
value entered =
speed of the
work chuck
during the lift
segment
CHUCK
SPEED
[wafer rotation
speed]
(in RPM)