Strasbaugh nTellect (Model 7AF) Wafer Grinder
9 - 12 Version 1.2 - June 2004
WAFER PARAMETERS
WARNING! If the Wafer Diameter is not correct, the robot will crash into
the wafers.
Be sure to set the Wafer Diameter (located in the Wafer
Parameters box) to match the diameter of the wafers to be
polished.
The three wafer parameters, listed below, are consistent for both coarse and fine grind.
One set of wafer parameters is stored per recipe.
Feed Wafer
Thickness
value entered = the maximum wafer thickness (in microns)
when measured before grinding.
Tape
Thickness
value entered = the thickness (in microns) of the protective
tape used on the front side of the wafer. This value is an
offset for wafer thickness.
Wafer
Diameter
value entered = the diameter (in inches or millimeters) of the
wafer to be ground.
ESTIMATED THROUGHPUT IN WAFERS PER HOUR
As you enter the parameter values for a recipe, the control computer calculates and
displays its estimate of the throughput in wafers per hour to be obtained from those
values.
Estimated
Throughput
(in wafers
per hour)
value displayed = estimated throughput in wafers per hour
to be obtained from the values entered at the Wafer Recipes
menu.
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