Vacuum Robot Manual
4000-0315 Rev 1
76
pitch. The station property that defines the distance between two slots in
the cassette. This number, together with the slot number and the taught Z
position, determines the Z coordinate of the location of a requested wafer.
pod. A box with a Standard Mechanical Interface (SMIF).
polar coordinates. Coordinate system with three coordinates: The angle
theta, the distance or magnitude r, and the z coordinate for height.
Process Module. SEMI/MESC term for a cluster tool station that can
perform a semiconductor process on a wafer.
repeatability. Ability to return to a given, or taught, coordinate.
servo motor. Motor with a feedback loop. The axis is connected to an
encoder that counts units traveled and sends this value back to the
controller.
SEMI. Semiconductor Equipment and Materials International, a
standards organization based in California and tasked with the generation
and compilation of standards related to the semiconductor industry.
SEMI/MESC. Semiconductor Equipment and Materials International /
Modular Equipment Standards Committee
SMIF. Standard Mechanical Interface, as defined by SEMI. Relates to a
system of closed PODS used to transport 200mm wafers cleanly.
stepper motor. Motor driven by providing a series of pulses to various
windings in the motor. Stepper motors are typically driven in fixed
increments (or steps) of motion, related to the physical construction of the
motor. Stepper motors are frequently used without a feedback loop in
motion systems. In such a system, the absolute position is calculated by
counting the number of steps the motor has made since it was homed.
stroke. The station property that is the total vertical distance used in
getting or putting a substrate. The total vertical distance traveled inside a
cassette during a GET or PUT. This distance is usually twice the value of
the offset.
TMC. Transport Module Controller. A microprocessor-based controller
used to direct the Cluster Tool through its wafer handling operations.
Transport Module. SEMI/MESC term for a module that accepts or
presents a single wafer outside the module across the interface plane for
transport.
Transport Module Controller. See TMC.
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