Strasbaugh nTellect (Model 7AF) Wafer Grinder
1 - 6 Version 1.2 - June 2004
ABOUT THE MACHINE
The nTellect (Model 7AF) Wafer Grinder is designed specifically for mechanical
grinding to remove material from the back side (the side opposite the electronics) of
semiconductor wafers to the desired thickness. The in- process digital measurement
probe is in contact with the wafer throughout the grinding process, providing constant
feedback and permitting grinding to an accuracy in microns. Fully automated wafer
handling provides cassette to cassette processing.
To achieve these goals Strasbaugh engineers have incorporated a number of
enhancements over previous grinders built by Strasbaugh and by its competitors.
Design emphasis has focused on maximizing potential grinding results, versatility,
reliability, and simplicity of operation.
The 7AF is built of special materials with optimum flatness and stable thermal
characteristics. In addition to superior mechanical design, the grinder utilizes efficient,
reliable computer and coprocessor systems for machine and process control functions.
The combined benefits of ergonomic design and state-of-the-art mechanical tolerances
and machine controls provide the superior process yield potential inherent in the
Model 7AF Wafer Grinder.
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