Operations and Maintenance Manual Mechanical Maintenance Procedures
Version 1.2 - June 2004 11 - 69
HANDLING AREA
Note: Perform the wafer handling area initial alignments each time the machine is
moved and at other times as needed.
SUMMARY
The list below summarizes the procedures required to complete the initial mechanical
alignments for the handling area of the machine. The procedures must be performed in
the order shown below.
I. Before You Begin (preparatory procedures)
II. Level the Robot
III. Level the Robot End Effector
IV. Align the Pre-Aligner with the Robot
V. Align the Spin-Rinse Station with the Robot
VI. Level the Four Cassette Platforms
VII. Adjust the Bed to a Position Parallel to the Robot
VIII. When the Grinding Area and Handling Area Initial Alignments Have Been
Satisfactorily completed
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