Strasbaugh nTellect (Model 7AF) Wafer Grinder
12 - 6 Version 1.2 - June 2004
Component
or
Function
Position or Status
BRIDGE
Present location of the bridge as measured in inches
from its right side (home) position.
Wheel Coarse Fine
Height Coarse spindle height
above the work chuck
after referencing,
measured in microns.
Fine spindle height above
the work chuck after
referencing, measured in
microns.
Speed Coarse spindle speed in
revolutions per minute.
Fine spindle speed in
revolutions per minute.
Motor Coarse spindle motor
current in amps.
Fine spindle motor current
in amps.
Force Amount of force in
pounds being applied to
the wafer by the coarse
spindle.
Amount of force in
pounds being applied to
the wafer by the fine
spindle.
Chuck Left Right
Probe Left probe measurement
in microns.
Right probe measurement
in microns.
Speed Left chuck speed in
revolutions per minute.
Right chuck speed in
revolutions per minute.
Vacuum Left chuck vacuum in
inches of mercury.
Right chuck vacuum in
inches of mercury.
Coolant Left chuck coolant flow in
gallons per minute.
Right chuck coolant flow
in gallons per minute.
Notes on Spindle Height and Probe Position Displays:
When the machine is first powered up, homing zeros out the screen readout for spindle
height at the limit switch located at the top of the stroke.
During homing, the location of the top of the work chuck is determined by counting,
beginning with zero, from the limit switch to the work chuck. The work chuck
location is lost after homing (a) due to wheel wear if the machine has been processing
wafers or (b) if the grind wheels or chucks have been dressed.
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