Operation and Maintenance Manual Model 7AF Wafer Grinder
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Number: 36 Value: 0.0 Label: Fine Max Whl/Wafer
When this much material has been worn away from the fine wheel during the
grinding of a single wafer, a warning is issued. The value zero in variable 36
means “do not test fine wheel wear per wafer.”
Number: 37 Value: 0.0 Label: Probe Bounce Threshold
Software version 5.06 allows the grinding of “rough” wafers having small
bumps. If a bump happens to lie on the circular path taken by the probe as it
travels around the wafer, the probe can be smacked out of the way. It can be
hit with enough force to make it lose track of its current position. The
coarse grind cycle has been modified to recover from this loss of information.
How to use this variable is described in the Release Notes for software
version 5.06. If this variable is zero, grinding behaves normally.
Number: 38 Value: 0.0 Label: Robot & Aligner Timeout
If the main computer requests status from the Equipe controller but receives
no reply, it will ask again after this timeout. The allowed values are 0.1 sec
to 3.0 sec. Any other value is treated as 3.0.
Number: 39 Value: 0.0 Label: Altitude Vacuum Adjust
This variable is introduced in software version 5.06. If a 7AF is located
above sea level, it had been getting incorrect values for its vacuum readings
in older software versions. This caused problems when a test is made for
sufficient vacuum. If you experience this problem, set machine variable 39 to
zero. Then read the work chuck vacuum from the screen while the 7AF is
idle. Finally, return to machine variable 39 and set it to the number you just
read.
Number: 40 Value: 250.0 Label: LT Chuck accel rpm/sec
Use this acceleration when moving the left work chuck.
Number: 41 Value: 250.0 Label: RT Chuck accel rpm/sec
Use this acceleration when moving the right work chuck.
Number: 42 Value: 0.0 Label: LT Chuck Wafer Dry secs
Added in version 5.08. See variable 44.
Number: 43 Value: 0.0 Label: LT Chuck Wafer Clean secs
Added in version 5.08. See variable 46.
Number: 44 Value: 0.0 Label: RT Chuck Wafer Dry secs
This variable was added in version 5.07. At the end of the grind cycle, after
the bridge has moved to expose the wafer, each chuck will continue to spin
for this many seconds at the speed it had been spinning during the Lift step of
the grind cycle. The meaning was changed in version 5.08 to apply to the
right chuck only. Also see variables 42, 43, 46.
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