Operation and Maintenance Manual Model 7AF Wafer Grinder
14
Number: 80 Value: 0.0 Label: Cassette Pitch inches
If this is set to zero, the height between wafers in the send and receive
cassettes will be set to 0.1875 inch for wafers of diameter 4-, 5-, and 6-inch
and set to 0.2500 inch for wafers of diameter 8-inch. For any other pitch, set
the value here. Note: The decimal point is required if you set this variable.
Starting with software version 5.07, negative values in variables 80 and 81
signal that the correct pitch and wafers per cassette are found in the robot
coordinate file. This allows send and receive cassettes to have different
dimensions. See the notes for version 5.07.
Number: 81 Value: 0.0 Label: Wafers per Cassette
If this is set to zero, the number of wafers per cassette will be set to 25. For
any other value, set it here. Or see the note on variable 80.
Note that the number of wafers in the cassette should be counted upward
starting from the bottom slot the robot is trained for. In certain situations
this may be the upper 24 slots of a 25-slot cassette because the robot end-
effector is too large to allow access to the bottom slot of the cassette. Or,
combining the large end-effector with extra thick wafers, this may use slots
2,4,6,… and a double-height pitch, for a total of twelve slots in a 25-slot
cassette.
Number: 82 Value: 0.0 Label: Cassette Flags
Before software version 5.00, this was labeled ATC Grinder 0=No and was
used to distinguish Force Grind from the other kinds of grinding. With
version 5.00 that choice was moved into the grind recipe.
Starting with software version 6.05, the value 1 in this variable will prevent
grinding if there is a wafer in the bottom slot of the send cassette. Use this if
there is not enough room for the robot to get that wafer.
Number: 83 Value: 0.0 Label: 83 no longer used
Before software version 5.00, this was labeled Prealigner Bypass 0=No and
prevented mis-alignment of certain difficult wafer shapes or materials by the
prealigner. With the prealigner bypass, wafers are placed onto the prealigner
but no attempt to align is made, so their position remains unchanged. With
version 5.00 the choice whether to bypass the prealigner was moved into the
grind recipe.
Grinding square wafers without the square wafer firmware or grinding clear
glass wafers are situations requiring the prealigner bypass.
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