Prealigner Bypass
When wafers cannot be accommodated by the prealigner, as in square media, the prealigning step can be
bypassed. The wafer will still be placed on the prealigner and retrieved, but the prealigning procedure will
not be done. To use this feature, change “Prealigner Bypass” (Machine Variable #83) to a non-zero
number. The prealigner step can be reinstated by setting “Prealigner Bypass” (Machine Variable #83) to
zero. Note that this version of the software preserves the orientation of the wafer from the send cassette to
the receive cassette.
Spin Station Indexing
The spin station is now returned to the same position when stopped to preserve the orientation of the wafer.
By bypassing the prealigner (see above), the wafer orientation is preserved from send cassette to receive
cassette.
7AF Version 3.02 Features
1/10/97 Ken Hill
Purpose
Software version 3.02 for the model 7AF contains the major changes of version 3.00 and revisions to allow
the grinding of alternative materials, such as ATC. This version is derived from a v3.00 test version and the
release version 3.01 for ATC grinding. Therefore, be sure to review the release documentation for both
versions 3.00 and 3.01 in addition to this document. This version exists because version 3.01 had to be
released before an official release of version 3.00 was made. If upgraded from a version before v3.00, new
FloPro runtime software, version 2.776, will be automatically installed. Likewise, new screen files (.GRS)
may be used and are automatically installed. This software must use Robot Macros, version 2.04!
Use of Hysteresis Values for Starting Grind
In the past, a preset force was used to detect contact with the wafer and transition to the first grind step feed
rate. Now, this force is read from the hysteresis setting. For the fine setting, use machine variable 56 and for
the coarse setting, use machine variable 58. This feature will allow the machine to be set for a wider range of
throughput /grind quality performance parameters.
7AF Version 3.03 Features
4/9/97 Ken Hill
Purpose
This was only released as an executable to one customer for grinding square ATC. Changes will be rolled
into future releases.
Changes
The first wafer that goes to the spin station while homing may not index properly. This was corrected by
always reindexing the chucks and spin station when leaving the Main Screen.
Dynamic rereferencing is only allowed to happen if the grind/polish force falls below the hysteresis pounds
set in machine variable 56. If this does not happen during the lift phase, dynamic rereferencing will not occur.
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