February 22, 2002 7AF Software Version 6.01 Features
STRASBAUGH CONFIDENTIAL INFORMATION
1
7AF Version “6.03” Features
09/09/2003 Paul Ostby
Purpose
Software version 6.03.0 introduces the Tapeless Cleaner (TLC) option and adds settings to support tapeless
backgrinding. No other functionality was added for this release.
Tapeless backgrinding requires a number of hardware changes and several software changes. This document will
discuss the software changes. Only a brief mention will be made of the hardware changes.
Tapeless Backgrinding
In normal backgrinding, the front (device side) of each wafer is covered with a layer of tape. The wafers are
placed device side down on the work chuck and the back side is ground down. After grinding, the wafers are
sent to the Spin/Rinse/Dry station (SRD, or Spin Station) to clean off the back side. The wafers are then sent to
a separate machine which removes the tape.
In tapeless backgrinding the front (device side) of each wafer is not covered with a layer of tape. Instead the
unprotected device side is placed face down on a special type of work chuck and the back side is ground down.
After grinding the back side, the wafer is thoroughly rinsed and dried while still on the work chuck. After the
back side is clean the wafer is sent to the Tapeless Cleaner (TLC) to clean off the front side. There is now no
need for a separate machine to strip tape off the device side of the wafer.
Thorough cleaning is critical to tapeless backgrinding. The back side of each wafer must be cleaned before the
wafer is removed from the work chuck. This is necessary in order to keep the robot end effector clean and, of
course, to clean the back side. Then the front (device) side of the wafer must also be thoroughly cleaned.
With normal backgrinding the SRD was used to clean the back side of the wafers and the tape protected the
front side. With tapeless backgrinding the back side of the wafer is cleaned on the work chuck, and the TLC
(which replaces the SRD) is used to clean the front side of the wafer.
To support tapeless backgrinding, the software now has added settings to support on-chuck cleaning and to
support the tapeless cleaner.
On-Chuck Cleaning
Previously, the software supported settings to rinse and dry wafers on the work chuck. These settings are found
in machine variables 42, 43, 44, and 46. These settings determine the rinse and dry time on each work chuck.
These optional rinse and dry steps would not adjust the chuck RPM; the work chuck would continue at the RPM
specified in the grind recipe for the Lift phase.
With version 6.03.0, two new settings have been added to allow the work chuck RPM to be modified for the
rinse and dry phases. Machine variables 52 and 51 now let you set the chuck RPM during rinse and dry,
respectively. This may be especially useful for the dry phase, where you may want to increase the chuck speed in
order to dry the wafers faster.
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