Xilinx Zynq-7000 User Manual

Zynq-7000 AP SoC and 7 Series FPGAs MIS v4.1 416
UG586 November 30, 2016
www.xilinx.com
Chapter 3: RLDRAM II and RLDRAM 3 Memory Interface Solutions
Here are the rules verified from the input XDC:
• If a pin is allocated to more than one signal, the tool reports an error. Further
verification is not done if the XDC does not adhere to the uniqueness property.
• Verified common rules:
°
The interface can span across a maximum of three consecutive banks.
°
Interface banks should reside in the same column of the FPGA.
°
Interface banks should be either High Performance (HP) or High Range (HR). HP
banks are used for the high frequencies.
°
The chosen interface banks should have the same SLR region if the chosen device is
of stacked silicon interconnect technology.
°
V
REF
I/Os should be used as GPIOs when an internal V
REF
is used or if there are no
input and input ports in a bank.
°
The I/O standard of each signal is verified as per the configuration chosen.
°
The VCCAUX I/O of each signal is verified and provides a warning message if the
provided VCCAUX I/O is not valid.
• Verified data pin rules:
°
Pins related to one strobe set should reside in the same byte group.
°
Write clocks (DK/DK#) should be allocated to the DQS I/O pair.
°
Read clocks (QK/QK#) should be allocated to the MRCC pins for RLDRAM II and
should be allocated to DQS I/O pair for RLDRAM 3.
°
Data (DQ) pins should not be allocated to DQS N pin.
°
An FPGA byte lane should not contain pins related to two different strobe sets.
°
V
REF
I/O can be used only when the internal V
REF
is chosen.
• Verified address pin rules:
°
Address signals cannot mix with data bytes.
°
It can use any number of isolated byte lanes
• Verified system pin rules:
°
System clock:
- These pins should be allocated to either SR/MR CC I/O pair.
- These pins must be allocated in the Memory banks column.
- If the selected system clock type is single-ended, you need to check whether the
reference voltage pins are unallocated in the bank or the internal V
REF
is used.
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Xilinx Zynq-7000 Specifications

General

Series	Zynq-7000
Number of Cores	Dual-core
Processor Speed	Up to 1 GHz
Device Type	SoC
Logic Cells	Up to 350K
DSP Slices	Up to 900
External Memory Interfaces	DDR3, DDR2, LPDDR2
I/O Standards	LVCMOS, HSTL, SSTL
Operating Temperature	-40°C to +100°C (Industrial), 0°C to +85°C (Commercial)
Package Options	Various BGA packages
I/O Voltage	3.3V

Summary

Chapter 1: DDR3 and DDR2 SDRAM Memory Interface Solution

Introduction

Overview of the DDR3 and DDR2 SDRAM Memory Interface Solution, its architecture, and features.

Features

Highlights enhancements in 7 series FPGA memory interface solutions over earlier families.

Chapter 2: QDR II+ Memory Interface Solution

Introduction

Details the QDR II+ SRAM Memory Interface Solution, its architecture, and usage.

Chapter 3: RLDRAM II and RLDRAM 3 Memory Interface Solutions

Introduction

Explains RLDRAM II/III Memory Interface Solutions, covering architecture, usage, and simulation.

Chapter 4: LPDDR2 SDRAM Memory Interface Solution

Introduction

Introduces the LPDDR2 SDRAM Memory Interface Solution, its core components, and features.

Features

Details enhancements in LPDDR2 SDRAM solutions, including performance and hardware blocks.

Chapter 5: Multicontroller Design

Introduction

Describes specifications, supported features, and pinout rules for multicontroller designs.

Chapter 6: Upgrading the ISE/CORE Generator MIG Core in Vivado

Appendix A: General Memory Routing Guidelines