Zynq-7000 AP SoC and 7 Series FPGAs MIS v4.1 187
UG586 November 30, 2016
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Chapter 1: DDR3 and DDR2 SDRAM Memory Interface Solution
CLKOUT0_PHASE –
Phase of PLL output CLKOUT0. This
value is set by the MIG tool based
on the banks selected for memory
interface pins and the frequency of
operation.
DIVCLK_DIVIDE –
PLLE2 VCO divisor. This value is set
by the MIG tool based on the
frequency of operation.
USE_DM_PORT
This is the enable data mask option used
during memory write operations.
0 = Disable
1 = Enable
CK_WIDTH
This is the number of CK/CK# outputs to
memory.
DQ_CNT_WIDTH This is ceil(log2(DQ_WIDTH)).
DRAM_TYPE
This is the supported memory standard for
the Memory Controller.
“DDR3”, “DDR2”
DRAM_WIDTH
This is the DQ bus width per DRAM
component.
AL This is the additive latency. 0
nBANK_MACHS
(1)
This is the number of bank machines. A
given bank machine manages a single
DRAM bank at any given time.
2, 3, 4, 5, 6, 7, 8
DATA_BUF_ADDR_WIDTH
This is the bus width of the request tag
passed to the Memory Controller. This
parameter is set to 5 for 4:1 mode and 4 for
2:1 mode. This parameter should not be
changed.
5, 4
SLOT_0_CONFIG
This is the rank mapping. This parameter
should not be changed.
Single-rank setting: 8'b0000_0001
Dual-rank setting: 8'b0000_0011
ECC
This is the error correction code, available in
72-bit data width configurations. ECC is not
currently available.
72
RANKS This is the number of ranks.
DATA_WIDTH
This parameter determines the write data
mask width and depends on whether or not
ECC is enabled.
ECC = ON:
DATA_WIDTH = DQ_WIDTH +
ECC_WIDTH
ECC = OFF:
DATA_WIDTH = DQ_WIDTH
APP_DATA_WIDTH
This UI_INTFC parameter specifies the
payload data width in the UI.
APP_DATA_WIDTH =
2 x nCK_PER_CLK x PAYLOAD_WIDTH
APP_MASK_WIDTH
This UI_INTFC parameter specifies the
payload mask width in the UI.
Table 1-65: Embedded 7 Series FPGAs Memory Solution Configuration Parameters (Cont’d)
Parameter Description Options
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