R5905948 /12 Event Master Devices 545
• 2 separate gigabit Ethernet network interface connections, one for
primary system control, and one for supplemental network (additional IP
address range and mode)
Dimensions (HxWxD) 244.34 x 901.19 x 575.36 mm (9.62 x 35.49 x 22.65 inches)
Weight 20.41 kg (45 lbs)
Temperature 0–35° C / 32–95° F
Humidity 0–95% non-condensing
*Note The EC-210 HDMI monitor connections do not support analog output.
Digital displays or active digital to analog converters are required.
A.11 Specifications of the CXP I/O card
R9004797 – CXP I/O card specifications
Connectors 1x CXP (120G)
A.12 Specifications of the Expansion Link card
R9004746 – Expansion Link card specifications
Connectivity
• Used for linking Event Master processors for expansion
• Uses CXP cable for connections
• Can be converted to MTP fiber optic cable to 300 m
A.13 Specifications of the S3 VPU card
R9004758 – S3 VPU card specifications
No specifications found.
A.14 Specifications of the SDI input card (Gen 1)
R9004742 – SDI input card specifications
HDCP HDCP mode is not applicable to SDI inputs or outputs.
Capacity Supports up to 4x 1080p@60 or 1x 4K@60p (4 quadrant or 2Si formats)
per card.
Input Each connector supports up to SMPTE 2K (2048x1080p60), 4:2:2, 10 bit.
A.15 Specifications of the SDI output card (Gen 1)
R9004741 – SDI output card specifications
HDCP HDCP mode is not applicable to SDI inputs or outputs.
Capacity Supports up to 4x 1080p@60 or 1x 4K@60p (4 quadrant or 2Si formats)
per card.
Output Each connector supports up to SMPTE 2K (2048x1080p60), 4:2:2, 10 bit.
Specifications
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