Page 4 2
nd
Edition – Rev 0
51-30
CONSUMABLE MATERIALS - GENERAL
solvent and allow to dry.
Application
For Slip Fitted Assemblies, apply adhesive
around the leading edge of the pin and the
inside of the collar and use a rotating motion
during assembly to ensure good coverage.
For Press Fitted Assemblies, apply adhesive
thoroughly to both bond surfaces and
assemble at high press on rates.
For Shrink Fitted Assemblies the adhesive
should be coated onto the pin, the collar
should then be heated to create sufficient
clearance for free assembly.
Parts should not be disturbed until sufficient
handling strength is achieved
Disassembly
Apply localized heat to the assembly to
approximately 250 °C. Disassemble while
hot.
Cleanup
Cured product can be removed with a
combination of soaking in a Loctite solvent
and mechanical abrasion such as a wire brush.
Sikaflex®-221 multi-purpose one-component
adhesive sealant
Surface preparation
Surfaces must be clean, dry and free from all
traces of grease, oil and dust.
Application (cartridge)
Cut off the tip of the nozzle to suit joint width
and apply the sealant into the joint with a
suitable hand operated gun. Once opened,
packs should be used up within a relatively
short time. Do not apply at temperatures
below 40°F (5°C) or above 105°F (40°C).
The optimum temperature for substrate and
sealant is between 60°F (15°C) and 77°F
(25°C).
Tooling and finishing
Tooling and finishing must be carried out
within the tack free time of the sealant.
Finishing agents or lubricants must be tested
for suitability/compatibility.
Removal
Uncured sealant can be removed from tools
and equipment with Sika Remover-208 or
another suitable solvent. Strictly follow
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