2.4.4.6 Equipotential bonding
The Installation of equipotential bondings are necessary if there are present or expected poten-
tial differences between parts of your application.
– The impedance of equipotential bonding must be equal or lower than 10 %
of the shield impedance of the shielded signal cables between the same
points.
– The conductor cross section of a equipotential bonding must be 16 mm² to
withstand the maximum possible compensating current.
– Equipotential bondings and shielded signal cables should be laid close to
each other.
– Equipotential bondings must be connected to PE with low impedance.
Fig. 175: AC500, equipotential bonding
1 Cabinet 1
2 Cabinet 2
3 Power supply for the CPU
4 Fuse for the CPU power
5 Power supply for the I/Os
6 Fuse for the I/O power
7 For fuses for the contacts of the relay outputs
8 0V rail
9 Grounding of the 0V rail
10 Cabinet grounding
11
Equipotential bonding between the cabinets min. 16 mm
2
12 Cable shields grounding
13 Fieldbus connection (e.g. Ethernet)
System assembly, construction and connection
Overall information (valid for complete AC500 product family) > EMC-conforming assembly and construction
2022/01/31 3ADR010278, 3, en_US 921
To Next Page
Loading...
