MPC5553/MPC5554 Microcontroller Reference Manual, Rev. 5
2-68 Freescale Semiconductor
Many changes were made to the footnotes of Ta ble 2 -1 (MPC5553) and Tab le 2 -2 (MPC5554). The number of footnotes to
Tabl e 2 -1 increased to 50 from 30. The number of footnotes to Tabl e 2- 2 increased to 36 from the 28 that was the total in the
MPC5553/MPC5554 version 3.1 reference manual. Among the more notable footnote changes are the following:
• Reconciled all footnotes with those in the MPC556X devices.
• Footnote 6 of the previous manual became Footnote 10 of MPC5553, and it was changed to read: “BOOTCFG[0] is not
available and will always be read as 0 in the 208 package of the MPC5553”
• Ta ble 2 -1 Added footnote 12. The EBI is 32 bits and can be configured as: a 32-bit external I/O data bus EBI; the lower
16-bits for the EBI and the upper 16-bits Fast Ethernet (FE); the calibration bus (CBI) uses 21 address pins [10:30] and 16
data pins [0:15].
• Added footnote 13 to Tabl e 2-1.
• Ta ble 2 -1 Added footnote 16 because the calibration bus interface (CBI) and the external bus interface (EBI) share the same
bus, the CBI uses EBI signals ADDR[12:26] in addition to the CAL_ADDR[10:11, 27:30] signals for calibration addressing.
Set the PA field in the SUI_PCR register to 0b1 to use the CBI or EBI.
• Footnotes 25/15 (in both devices): changed “The function of the MDO[11:4]_GPIO[82:75] pins is selected during a debug
port reset by the EVTI pin.” to read “The function of the MDO[11:4]_GPIO[82:75] pins is selected during a debug port reset
by the EVTI pin or by selecting FPM in the NPC_PCR.”
• Changed footnote 33 in Ta bl e 2- 1 from: 0b000 to 0b00 for analog serial data strobe functions. These registers have a 2-bit
PA value. Changed footnote 20 in Ta bl e 2- 2 from: 0b000 to 0b00. Changed in the detailed signal description as well.
• Removed CAL_OE
, CAL_RD_WR and CAL_TS from Table 2 -1. Added footnotes 18, 20, and 21 that the calibration bus uses
the OE, RD_WR, and TS external bus functions:
• Because the calibration bus interface (CBI) and the external bus interface (EBI) share the same external bus, RD_WR
is
used for both the CBI and the EBI.
• Because the calibration bus interface (CBI) and the external bus interface (EBI) share the same external bus, OE is used
for both the CBI and the EBI.
• Because the calibration bus interface (CBI) and the external bus interface (EBI) share the same external bus, TS
is used
for both the CBI and the EBI.
• Footnotes 23/25 in the previous version of the manual became Footnote 41 which changed from: “The V
DDAn
and V
SSAn
supply inputs are separate traces in the package substrate. Each trace is bonded to a separate pad location, which provides
isolation between the analog and digital sections within each ADC.” to “Each VDDAn and VSSAn connects to one ADC
engine to provide isolation.
”
• Changed Footnote 1 of the Power/Ground segmentation tables of both devices to read: “These are nominal voltages. V
DDE
is
1.62–3.6 V; V
DDEH
is 3.0–5.5 V. All V
DDE
voltages are 10%; V
DDEH
voltages are +5%/–10%.V
RC33
is 10%; V
DDSYN
is 10%; V
DDA1
is
+ 5%, –10%.
”
Table 2-10. Changes Added to MPC5553/5554 RM for Rev. 5.0 Release
In Ta bl e 2- 1 and Ta bl e 2- 2, corrected the ball numbers in the Power / Ground Signals section, Pin Labels / Package Type
column.
Table 2-9. Changes Added to MPC5553/5554RM for Rev. 4.0 Release (Continued)
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