Fujitsu Oracle SPARC M12-2

3.4.3 Types of Maintenance for FRU Removal (SPARC M12-2S in the
Multiple-BB Configuration) 64
Chapter 4 FRU Replacement Workflows 69
4.1 Active/Hot Replacement Workflows 69
4.1.1 Active/Hot Replacement Workflow of the XSCFU 70
4.1.2 Active/Hot Replacement Workflow of a PCIe Card 71
4.1.3 Active/Hot Replacement Workflow of the Power Supply Unit
(PSU) 72
4.1.4
Active/Hot Replacement Workflow of the FANU 72
4.1.5 Active/Hot Replacement Workflow of the HDD/SSD 73
4.1.6 Active/Hot Replacement Workflow of the PCI Expansion Unit
74
4.2 Active/Cold Replacement Workflows 76
4.2.1 Active/Cold Replacement Workflow of the XSCFU 76
4.2.2 Active/Cold Replacement Workflow of a PCIe Card 78
4.2.3 Active/Cold Replacement Workflow of the
PSU 79
4.2.4 Active/Cold Replacement Workflow of the FANU 81
4.2.5 Active/Cold Replacement Workflow of the FANBPU 82
4.2.6 Active/Cold Replacement Workflow of the HDD/SSD 83
4.2.7 Active/Cold Replacement Workflow of the HDDBPU 85
4.2.8 Active/Cold Replacement Workflow of the OPNL 86
4.2.9 Active/Cold Replacement Workflow of the CMU 87
4.2.10 Active/Cold Replacement Workflow
of Memory 89
4.2.11 Active/Cold Replacement Workflow of the BPU 90
4.2.12 Active/Cold Replacement Workflow of the PSUBP 91
4.2.13 Active/Cold Replacement Workflow of the PCI Expansion Unit
93
4.2.14 Active/Cold Replacement Workflow of the XSCF DUAL
Control Cable 94
4.2.15 Active/Cold Replacement Workflow of the XSCF BB Control
Cable 96
Contents v