GigaDevice Semiconductor GD32F3x0 - Page 664

GD32F3x0 User Manual
664
description of the temperature sensor.
4. Register definition chapter: modified the description of EWIE
bit in WWDGT_CFG register.
5. Modified the description Power management unit (PMU)
chapter.
2.5
1. Add GD32F310 series products.
Jan.06, 2022
2.5
1. Modified the description Inter-integrated circuit interface
(I2C) chapter.
2. Reset and clock unit (RCU) chapter: modified the
description of Table 4 2. Core domain voltage selected in
Deep-sleep mode and Deep-sleep mode voltage register
(RCU_DSV).
3. Direct memory access controller (DMA) chapter: modified
the description of MEMTOMEM to M2M in Figure 9 4. DMA
request mapping.
4. Modified the description Timer (TIMERx) chapter.
5. Modified the description Analog to digital converter (ADC)
chapter.
6. Modified the description Inter-integrated circuit interface
(I2C) chaptern.
7. Modified the description General-purpose and
alternate-function I/Os (GPIO) chapter.
8. Modified the description Serial peripheral interface/Inter-IC
sound (SPI/I2S) chapter.
9. Flash memory controller (FMC) chapter: modified the
description of PGERR bit and BPEN bit in Status register
(FMC_STAT) and Wait state enable register (FMC_WSEN).
Jun.30, 2022