Intel
®
EP80579 Integrated Processor Product Line May 2010
Order Number: 320068-005US 134
System Memory Interface (DIMM)—Intel
®
EP80579 Integrated Processor Product Line
9.8 Decoupling Recommendations
When designing a board, the following decoupling recommendations should be
followed:
• Capacitors should be mounted as close to the EP80579 as possible. They should be
no further than 10 mm from the edge of the EP80579 package for the DDR2
channel.
• Decoupling caps should be placed near any signal reference layer change.
This can
be done by adding a 0.1μF capacitor between DDR Power and Ground where the
Memory Clock traces change reference layers.
Note: These decoupling recommendations are for the EP80579 pins. Place multiple capacitors
in parallel to get the desired value for capacitance and ESL.