Intel EP80579 Guide

Intel
®
EP80579 Integrated Processor Product Line May 2010
Order Number: 320068-005US 265
Debug Port Design Guide—Intel
®
EP80579 Integrated Processor Product Line
26.3.3.8 XDP_Present
This optional steady-state output from the run-control hardware indicates the presence
of an ITP-XDP-style tool at the debug port. To use this tool, the target system must
provide a pull-up termination of 1k to 10k ohm to this signal. Termination voltage for
this signal can be to any voltage that is compatible with the receiver chosen by the
platform design.
When the ITP-XDP tool is present, the ITP-XDP tool will short this pin to ground.
26.3.4 I
2
C (SDA/SCL) Routing Guidelines
The I
2
C interface from the ITP-XDP includes two pins – SDA and SCL. Route the debug-
port SDA pin to the SDA signal of the I
2
C on the system. Route the debug port SCL pin
to the SCL signal of the I
2
C on the system. The I
2
C ITP-XDP interface is master only
and cannot be slave addressed. The I
2
C ITP-XDP master can be connected to any
multiple-master I
2
C bus within the target system that provides access to the hooks
required for validation and debug. The ITP-XDP conforms to the multi-master rules of
the I
2
C bus. The debug port has no additional requirements for termination on these
signals beyond the I
2
C specifications. The I
2
C ITP-XDP is compatible with I
2
C and SM
Bus protocols.
There are no additional requirements for termination on these signals beyond the I
2
C
specifications.
26.3.5 Power
26.3.5.1 VCC_OBS Pins
The VCC_OBS_AB and VCC_OBS_CD pins are used by the ITP-XDP hardware to provide
termination voltage to the OBS interface. Connect VCC_OBS_AB and VCC_OBS_CD to
the voltage listed in the system-connection table. Decoupling capacitors are not
required for these signals.
Each of these pins draws ~200mA of current.
26.3.5.2 Ground
All XDP ground signals must be tied directly to the system ground with little to no trace
from the debug port.
26.4 System Connection
The XDP connector placed on the target system is a Samtec* 60-pin BSH-030-01 series
connector. Specific plating types, locking clips, and alignment pins versions of this
connector can be obtained from Samtec*. Table 95 documents the pinout for ITP-XDP
connector.
Table 95. XDP To EP80579 Signal Connections (Sheet 1 of 2)
Pin XDP Signal Name
Target
Signal
I/O Device Pin
XDP Signal
Name
Target
Signal
I/O Device
1 GND GND NA 2 GND GND NA System
3OBSFN_A0
BPM5_PREQ
_IN
I/O EP80579 4 OBSFN_C0 Open NA
5OBSFN_A1
BPM4_PRDY
_OUT
I/O EP80579 6 OBSFN_C1 Open NA

Intel EP80579 Specifications

General

Brand	Intel
Model	EP80579
Category	Computer Hardware
Language	English