4535 611 98931 iE33 Service Manual Page 86
CSIP Level 1 Theory of Operation: Physical Structure
Acquisition
Subsystem
The Acquisition Subsystem controls the transducer, generates the electrical impulse (pulse) that
creates sound waves, and converts the returning echo information into digital data.
The Acquisition Subsystem consists of:
• Scanhead Select Module (S/HSEL)
• Front End Controller Module (FEC)
• Acquisition Frontplane (AcqF)
• Four Channel Boards (CB0 through CB3)
• Neo Analog Interface Module (NAIM)
• Motor Controller PCB (daughtercard to FEC)
Scanhead Select Module -S/HSEL
• Selects between transducer connectors
• Interface between the front-end PCBs and the transducer
• Provides the signal path for TGC1 and TGC2 voltages from the NAIM to the Channel Boards
for non-Matrix transducers. For the X3-1 Matrix transducer, provides the signal path for
TGC voltages from the NAIM to the transducer
• Provides the signal path for CW Doppler I and Q signals from the Channel Boards to the
NAIM
• Connects transducer personality information from the transducer to the NAIM
• Provides relay status signals to the NAIM, indicating the status of the multiplexers
• 3X or 4X multiplexers for the 128 Channel Board transceivers to the transducer connectors
• CW Doppler multiplexer for connecting transmit signal from NAIM to CW/PW connector
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