4535 611 98931 iE33 Service Manual Page 98
CSIP Level 1 Theory of Operation: X3-1 Transducer Theory
Channel Board and NAIM sensors are in the input and exhaust air streams. The sensor for the
FEC is located in the exhaust air stream. The temperatures are not monitored for the first 10
minutes of system operation. After that the system fan speeds are automatically adjusted accord-
ing to the system temperatures at the various sensor locations.If the sensor temperatures drop
too low, the fan speeds drop.
Temperature monitoring in the Platform Card Cage is accomplished with a temperature sensor
on each of the motherboards and one on the AVIO-RIP
X3-1 Trans-
ducer Theory
The X3-1 matrix transducer is a non-motorized 3D transducer. Transducer identification (per-
sonality) is controlled the same as for other transducers.
The transmit path for the X3-1 transducer is contained within an ASIC in the transducer. Beam-
former control lines from the NAIM are used to control beamformer timing (for 2400 ele-
ments), TGC, and transducer power. Some of the control information originates in the FEC
PCB. The Channel Boards are not used for the X3-1 transmit signal path. Programming functions
that are normally stored in Channel Board Ram are stored in 32 MBytes of memory located on
the NAIM. The programming information is transferred to the beamformer via the MX Bus.
The receive path within the system is similar to that of other transducers, however, the signals
received from the 2400 elements are multiplexed to 128 packets of information. The packets are
processed the same as signals received from other transducers. The signals are sent to the sys-
tem back-end on the RF A and RF B data buses.
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