Phaser 6500/WorkCentre 6505 Service Manual Xerox Internal Use Only xix
Electrostatic Discharge (ESD) Precautions
Some semiconductor components, and the respective sub-assemblies that contain
them, are vulnerable to damage by Electrostatic Discharge (ESD). These
components include Integrated Circuits (ICs), Large-Scale Integrated circuits
(LSIs), field-effect transistors, and other semiconductor chip components. The
following techniques will reduce the occurrence of component damage caused by
static electricity.
Be sure the power is Off and observe these other safety precautions.
• Immediately before handling any semiconductor components assemblies,
drain the electrostatic charge from your body. This can be accomplished by
touching an earth ground source or by wearing a wrist strap device connected
to an earth ground source. Wearing a wrist strap will also prevent
accumulation of additional bodily static charges. Be sure to remove the wrist
strap before applying power to the unit under test to avoid potential shock.
• After removing a static sensitive assembly from its anti-static bag, place it on
a grounded conductive surface. If the anti-static bag is conductive, you may
ground the bag and use it as a conductive surface.
• Do not use freon-propelled chemicals. These can generate electrical charges
sufficient to damage some devices.
• Do not remove a replacement component or electrical sub-assembly from its
protective package until you are ready to install it.
• Immediately before removing the protective material from the leads of a
replacement device, touch the protective material to the chassis or circuit
assembly into which the device will be installed.
• Minimize body motions when handling unpacked replacement devices.
Motion such as your clothes brushing together, or lifting a foot from a
carpeted floor can generate enough static electricity to damage an electro-
statically sensitive device.
• Handle ICs and Erasable Programmable Read-Only Memories (EPROM’s)
carefully to avoid bending pins.
• Pay attention to the direction of parts when mounting or inserting them on
Printed Circuit Boards (PCB’s).
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