PR-MEM (TN2404/TN790 RISC Memory)
Issue 4 May 2002
10-1407555-233-123
Memory Functional Test (#332)
This test is destructive.
This test ensures that every DRAM memory location can be accessed and
changed independently. Running this test wipes out all data in DRAM memory.
This test is performed during a reset system 4 or reset system 5. If the test fails
during a reset system command, refer to the “Procedure for SPE-Down Mode” in
the Chapter 4, ‘‘Initialization and Recovery’’ for the recommended maintenance
strategy. This test can be run as a long demand test on the standby SPE.
Table 10-526. TEST #332 Memory Functional Test
Error
Code
Te s t
Result Description/Recommendation
100 ABORT The test did not complete within the allowable time period.
1. Retry the command.
1000 ABORT System resources required to run this test are not available.
1. Retry the command at 1-minute intervals a maximum of 3
times.
1029
2014
2015
2016
2017
2018
2020
2022
2024
2025
2051
ABORT Refer to STBY-SPE Maintenance documentation for a
description of these error codes.
1 - 7 FAIL The Standby SPE Processor circuit pack is defective.
1. Repeat the command at 1-minute intervals a maximum of 5
times.
2. If the test still shows a failure, replace the Processor circuit
pack. (Note that if you replace the Processor circuit pack,
you need to obtain a new license file.)
PASS The Standby SPE Processor circuit pack is healthy.
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