MPC5604B/C Microcontroller Reference Manual, Rev. 8
Freescale Semiconductor 61
4.8 Nexus 2+ pins
In the 208 MAPBGA package, eight additional debug pins are available (see Table 4-4).
10
The TDO pad has been moved into the STANDBY domain in order to allow low-power debug handshaking in
STANDBY mode. However, no pull-resistor is active on the TDO pad while in STANDBY mode. At this time the pad
is configured as an input. When no debugger is connected the TDO pad is floating causing additional current
consumption. To avoid the extra consumption TDO must be connected. An external pull-up resistor in the range of
47–100 k should be added between the TDO pin and VDD. Only in case the TDO pin is used as application pin
and a pull-up cannot be used then a pull-down resistor with the same value should be used between TDO pin and
GND instead.
11
Available only on MPC560xC versions and MPC5604B 208 MAPBGA devices
12
Not available on MPC5602B devices
13
Not available in 100 LQFP package
14
Available only on MPC5604B 208 MAPBGA devices
15
Not available on MPC5603B 144-pin devices
Table 4-4. Nexus 2+ pin descriptions
Debug pin Function
I/O
direction
Pad type
Function
after reset
Pin number
100
LQFP
144
LQFP
208 MAP
BGA
1
1
208 MAPBGA available only as development package for Nexus2+
MCKO Message clock out O F — — — T4
MDO0 Message data out 0 O M — — — H15
MDO1 Message data out 1 O M — — — H16
MDO2 Message data out 2 O M — — — H14
MDO3 Message data out 3 O M — — — H13
EVTI Event in I M Pull-up — — K1
EVTO Event out O M — — — L4
MSEO Message start/end out O M — — — G16
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