NXP Semiconductors KL25 Series - Default Chapter; Table of Contents

Contents
Section number Title Page
Chapter 1
About This Document
1.1 Overview.......................................................................................................................................................................33
1.1.1 Purpose.........................................................................................................................................................33
1.1.2 Audience......................................................................................................................................................33
1.2 Conventions..................................................................................................................................................................33
1.2.1 Numbering systems......................................................................................................................................33
1.2.2 Typographic notation...................................................................................................................................34
1.2.3 Special terms................................................................................................................................................34
Chapter 2
Introduction
2.1 Overview.......................................................................................................................................................................35
2.2 Kinetis L Series.............................................................................................................................................................35
2.3 KL25 Sub-Family Introduction.....................................................................................................................................38
2.4 Module functional categories........................................................................................................................................39
2.4.1 ARM® Cortex™-M0+ Core Modules.........................................................................................................39
2.4.2 System Modules...........................................................................................................................................40
2.4.3 Memories and Memory Interfaces...............................................................................................................41
2.4.4 Clocks...........................................................................................................................................................41
2.4.5 Security and Integrity modules....................................................................................................................42
2.4.6 Analog modules...........................................................................................................................................42
2.4.7 Timer modules.............................................................................................................................................42
2.4.8 Communication interfaces...........................................................................................................................43
2.4.9 Human-machine interfaces..........................................................................................................................44
2.5 Orderable part numbers.................................................................................................................................................44
Chapter 3
Chip Configuration
3.1 Introduction...................................................................................................................................................................45
KL25 Sub-Family Reference Manual, Rev. 3, September 2012
Freescale Semiconductor, Inc. 3