-SCS Parameter Analyzer Reference Manual Appendix L: Wafer-
level reliability testing
4200A-901-01 Rev. C / February 2017 L-7
Electromigration project
The Electromigration project (em-const-i) is shown in the figure below.
Figure 834: em-const-i project tree
The subsite (em) is configured for subsite cycling using current stressing on a single device (metal-
line). This project includes actions to control the temperature of the chuck. The subsite will not start
cycling until the chuck reaches the specified temperature. After the first pre-stress cycle to perform a
characterization test on the device, subsequent cycles current stress the device for a specified time
before repeating the test. After the subsite completes, the cooldown action cools the chuck.
The Stress Properties setup window for the em-const-i project is shown in the following figure.
Figure 835: Stress Properties pane: em-const-i project
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