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Siemens Hicom 150 E Office - Page 20

Siemens Hicom 150 E Office
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Figure 3-23 S0 networking options
Figure 3-24 S0 bus to the STMD8 via the MDFU/MDFU-E
Figure 3-25 Wiring example of Mini-Western jacks
Figure 3-26 S0 bus - example of wall socket assignment
Figure 3-27 TIEL (S30810-Q2520-X)
Figure 3-28 E&M interface, type 1
Figure 3-29 E&M interface, type 1A
Figure 3-30 E&M interface, type 1B or 5
Figure 3-31 E&M interface, type 2
Figure 3-32 E&M interface, type 2 - circuit diagram, MDFU/MDFU-E numbering
Figure 3-33 TLA2/TLA4 interfaces (S30817-Q923-Bxxx/Axxx)
Figure 3-34 TLA8 interfaces (S30817-Q926-Axxx)
Figure 3-35 TML8W (S30817-Q626-Axxx/Bxxx)
Figure 3-36 TMOM (S30810-Q2535-X)
Figure 3-37 TMOM - PSE interface
Figure 3-38 TMS2 (S30810-Q2915-X)
Figure 3-39 S2M trunk connection
Figure 3-40 S2M feeding of NTs in systems with no USVI
Figure 3-41 S2M feeding of NTs in systems with USVI
Figure 3-42 S2M - NT connection
Figure 3-43 S2M networking options
Figure 3-44 TS2 interfaces (S30810-Q2913-X)
Figure 3-45 S2M trunk connection
Figure 3-46 Supplying NTs via S2M in the case of systems without USVC
Figure 3-47 Supplying NTs via S2M in the case of systems with USVC
Figure 3-48 4SLA/8SLA interfaces (S30810-Q2925-X)
Figure 3-49 16SLA interfaces (S30810-Q2923-X)
Figure 3-50 ALUM4 interface (S30817-Q935-A)
Figure 3-51 ALUM4 principle structure
Figure 3-52 EXM interfaces (S30817-Q902-Bxxx)
Figure 3-53 GEE8 (S30817-Q664-xxxx)
Figure 3-54 GEE12/16/50 interfaces (S30817-Q951-A)
Figure 3-55 MPPI interface (S30817-Q5380-X)
Figure 3-56 OPA interfaces (S30807-Q6920-X)
Figure 3-57 PFT by means of PFT1/PFT4
Hicom 150 E Office Rel.1.0 Service Manual - Figures
http://cmweb01.mch.pn.siemens.de/e_doku/en/h150/h15/30/sh/2/h150_ehb.htm (2 of 6) [06/04/2000 13:02:15]

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