40 Rockwell Automation Publication 2198-UM004D-EN-P - December 2022
Chapter 2 Plan and Install the Kinetix 5100 Drive System
Electrical Noise Reduction This section outlines best practices that minimize the possibility of noise-
related failures as they apply specifically to Kinetix 5100 system installations.
For more information on the concept of high-frequency (HF) bonding, the
ground plane principle, and electrical noise reduction, see the System Design
for Control of Electrical Noise Reference Manual, publication GMC-RM001
.
HF Bond the Drives
Bonding is the practice where you connect the metal chassis, assemblies,
frames, shields, and enclosures to reduce the effects of electromagnetic
interference (EMI).
Unless specified, most paints are not conductive and act as insulators. To
achieve a good bond between drive and the subpanel, surfaces must be paint-
free or plated. Bonding the metal surfaces creates a low-impedance return
path for high-frequency energy.
Improper bonding of the metal surfaces blocks the direct return path and
allows high-frequency energy to travel elsewhere in the cabinet. Excessive
high-frequency energy can affect the operation of other microprocessor
controlled equipment.
These illustrations show recommended practices for bonding the painted
panels, enclosures, and brackets.
IMPORTANT
To improve the bond between the drive and subpanel, construct your
subpanel out of zinc-plated (paint-free) steel.
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