Glossary-4 Sun Blade 1500 Service, Diagnostics, and Troubleshooting Manual • December 2004
H
HBGA High-density ball grid array. The mechanical connection between a chip and a
printed circuit board.
I
I
2
C Inter-integrated circuits. A chip-to-chip serial bus.
IChip2 Interrupt concentrator chip.
IDE Integrated drive electronics. An interface for mass storage devices. The
controller is integrated with the disk or CD-ROM drive.
IEEE Institute of Electrical and Electronics Engineers, Inc. The organization
establishes standards for some computers and electrical components.
IEEE 1394 A high-speed communications protocol.
interleaving Memory access that alternates between DIMMs and banks based on the lover
order address bits.
DIMM interleaving interleaves between pairs of DIMMS.
Bank interleaving is interleaving within a single device on a DDR1 SDRAM.
Rank interleaving interleaves between a pair of memory devices on a single
DIMM.
XOR Interleaving. Exclusive-OR interleaving. A DIMM interleaving mode that
is used to distribute L2 cache conflict misses and L2 cache read/writeback
pairs across more banks than other interleaving modes. To use XOR
interleaving, all DIMMS must be identical.
I/O Input/output.
ISA bus The ISA bus is an I/O bus that runs at 8MHz and is used in the PCI-ISA
bridge.
I-TLB Instruction translation look-aside buffer.
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