KLA Tencor P-16+ - Creating Stress Data; Load a Wafer on the Stress Locator; Loading Wafers; Table 9.2 Elastic Constant of Substrates

Stress (Optional feature) - Creating Stress Data KLA-Tencor P-16+ / P-6 User’s Guide
9-8 KLA-Tencor Confidential 0142530-000 AB
3/13/09
The following is a list of common substrates and their corresponding modulus. The
Orientation is the crystalline orientation of the substrate being tested.
CREATING STRESS DATA 9
Load a Wafer on the Stress Locator 9
It is essential that the wafer be placed in the same place, in the same orientation on the
stage, for both the pre- and post-stress scans. It is also very important that the wafer
be supported on three points. If the wafer rests flat on the stage, its weight could
create deformation that could distort the stress data. For these reasons it is essential
that the stage be equipped with a stress precision locator.
Loading Wafers 9
The system might come with one of the two stress locators. Check the stress locator
received with the system against the image displayed in Figure 9.3.
Table 9.2 Elastic Constant of Substrates
Substrate Material Orientation Elastic Constants
(10
11
Pa)
Aluminum n/a 1.030
Aluminum Oxide (Al
2
O
3
) amorphous 3.835
Aluminum Oxide (Al
2
O
3
) amorphous 4.895
Aluminum Nitride (AIN) amorphous 4.367
Beryllium Oxide (BeO) amorphous 4.367
Borophosphosilicate (BPSG) Glass amorphous 1.500
Gallium Arsenide (GaAs) 111 1.741
Gallium Arsenide (GaAs) 100 1.239
Germanium (Ge) 111 1.837
Germanium (Ge) 100 1.420
Phosphosilicate (PSG) Glass amorphous 0.988
Quartz amorphous 0.850
Sapphire amorphous 4.080
Silicon 111 2.290
Silicon 100 1.805
Sodalime glass (Corning microsheet 0211) amorphous 0.973