KLA Tencor P-16+ - Chapter 10 3 D Stress (Optional Feature, P-16+ Only); Introduction; Definitions; Table 10.1 Common Terms Defined

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3/13/09
KLA-Tencor P-16+ / P-6 User’s Guide 3D Stress (optional Feature, P-16+ only) -
3D STRESS (OPTIONAL FEATURE, P-16+ ONLY) Chapter 10
10
Introduction 10
In addition to performing 2D stress measurements, the P-16+ has the capability to
perform full wafer stress measurements, with the aid of Apex software. 3D stress
allows the examination of wafer stress over the entire wafer, instead of a single line as
with 2D stress analysis. The theory of operation is identical to 2D stress, in which a
bare wafer reference scan is taken and then comparing this to a post deposition scan.
The stress values are calculated by subtracting the curvature of the
"pre-measurement" reference scan from the curvature of the "post-measurement"
scan.
Definitions 10
Some common terms that will be referenced in this chapter are defined in Table 10.1.
Table 10.1 Common Terms Defined
Item Definition
Stress Recipe Refers to a recipe which once run, the collected data is used for stress
related measurements
Stress Recipe Catalog Current interface database where stress recipes are saved.
Stress Scan Data Refers to a collected data set that shall be later used for calculating
stress related measurements. There is no significant difference
between regular profiler scan data and a “stress data” scan in terms of
the raw data. Different terminology is used only to indicate such a data
scan shall be used for stress related measurements and applications.
A stress scan is later identified as a Pre-measurement scan or as a
Post-Measurement scan by a user prior to calculating stress results.
Stress Data Catalog Interface database where stress scan data is saved.
Stress Difference Catalog Database where stress results shall be saved. Stress results are the
processing of a Post-Measurement and a Pre-Measurement.
“Pre-Measurement” Scan Name given to identify a scan trace derived from a scan taken before
film deposition. Also refers to a scan that will be used as reference in
comparing a Post deposition scan.
“Post-Measurement” Scan Name given to identify a scan trace derived from a scan taken after film
deposition. Also refers to the scan for which data compared against a
Pre-deposition scan.
“Difference” Map Name given to the map that shows the topographical difference by
subtracting the Post-measurement scan from the Pre-measurement
scan.
Average Radius of Curvature The averaged radius of curvature over the entire length of the scan.
Radius of Curvature The radial value belonging to a radius fit at a user specified location of
a profile. This is the Radius of Curvature for the length defined by the
measurement cursors.