– The impedance of equipotential bonding must be equal or lower than 10 %
of the shield impedance of the shielded signal cables between the same
points.
– The conductor cross section of a equipotential bonding must be 16 mm² to
withstand the maximum possible compensating current.
– Equipotential bondings and shielded signal cables should be laid close to
each other.
– Equipotential bondings must be connected to PE with low impedance.
Fig. 200: AC500, equipotential bonding
1 Cabinet 1
2 Cabinet 2
3 Power supply for the CPU
4 Fuse for the CPU power
5 Power supply for the I/Os
6 Fuse for the I/O power
7 For fuses for the contacts of the relay outputs
8 0V rail
9 Earthing of the 0V rail
10 Cabinet earthing
11
Equipotential bonding between the cabinets min. 16 mm
2
12 Cable shields earthing
13 Fieldbus connection (e.g. Ethernet)
2.4.5 Power Consumption of an Entire Station
The power consumption of a complete station consists of the sum of all individual consump-
tions.
System Assembly, Construction and Connection
Overall Information (valid for complete AC500 Product Family) > Power Consumption of an Entire Station
2019/04/17 3ADR010121, 13, en_US 1189