Toshiba GR200 Series - 5.3 Signal processing and communication module (CPU); 5.3.1 Signal processing

6F2S1914 (0.49)
GRL200 (Soft 033 & 037)
1039
Signal processing and communication module (CPU)
A signal-processing and communication module (CPU) are made up of a main circuit board for
processing (CP1M) and ‘piggyback’ circuit boards for communication modules (COM#1 to
COM#5). These circuit boards are designed for LAN, time synchronization and others. They
are mounted on the CPU main board by their connectors. Figure 5.3-1 shows a board
implementation example.
COM#2
CP1M
CPU
COM#1
CPU
COM#3
COM#4
COM#5
Figure 5.3-1 CUP and their communication modules (COM#1 to COM#5)
Note: The implementation of COM#1 to #5 may vary according to circumstances.
5.3.1 Signal processing
The operation of relay and control applications are achieved with the CPU on the CP1M board.
The CPU board has SDRAM, MRAM, and NOR-Flash; the NOR-Flash is used to store setting
data and recording data; the MRAM is used to store several counter values. Both are of non-
volatile memory so that the stored data will be not be erased if the power is cut off.
CPU
VCT#1
VCT#2
BIO#1
BIO#2
BIO#3
BIO#4
BIO#5
BIO#6
BIO#7
BIO#8
IED
COM#1
COM#2
COM#5
LAN network
CP1M
COM#3
COM#4
Remote IED1
Remote IED2
IRIG-B
Figure 5.3-2 Diagram of processing