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NXP Semiconductors MPC5566 - External Signal Description

NXP Semiconductors MPC5566
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Enhanced Serial Communication Interface (eSCI)
MPC5566 Microcontroller Reference Manual, Rev. 2
Freescale Semiconductor 21-3
21.2 External Signal Description
This section provides a description of all eSCI external to the MCU.
Each eSCI module has two I/O signals connected to the external MCU pins. These signals are summarized
in Table 21-1 and described in more detail in the following sections.
21.2.1 Detailed Signal Description
21.2.1.1 eSCI Transmit (TXDA, TXDB)
These signals transmit data out for the eSCI.
21.2.1.2 eSCI Receive Pin (RXDA, RXDB)
These signals receive data input for the eSCI.
21.3 Memory Map and Register Definition
21.3.1 Overview
This section provides a detailed description of all memory and registers.
21.3.2 Module Memory Map
The memory map for the eSCI module is shown in Table 21-2. The address offset is listed for each register.
The total address for each register is the sum of the base address for the eSCI module (ESCIx_base) and
the address offset for each register. There are two eSCI modules on this device:
eSCI A base address is 0xFFFB_0000
eSCI B base address is 0xFFFB_4000
Table 21-1. eSCI Signals
Signal Name
1
1
x indicates eSCI module A or B
I/O Description
RXDx I eSCI receive
TXDx OeSCI transmit

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