MPC5566 Microcontroller Reference Manual, Rev. 2
Freescale Semiconductor
Chapter 2
Signal Description
This chapter describes the external device signals, including a table of signal properties, detailed
descriptions of the available signals, and the I/O pin power/ground segmentation.
2.1 Block Diagram
To provide an extensive feature set and compatibility between the MPC5500 devices, most of the balls
have multiplexed signal functions. Primary signal functions that are not available on the device, but are
used as pin labels in the Ball Grid Array (BGA) map are listed in Table 2-1.
Figure 2-1 shows only the signals that are available on the device. Read the last two columns in Table 2-1
for a list of BGA package connections provided by the VertiCal assembly.
NOTE
The Vertical assembly has ball connections for all the available signals on
the device.
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