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System and Peripheral Control Registers
179
SPNU563A–March 2018
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Architecture
2.5.1.28 Die Identification Register Lower Word (DIEIDL)
The DIEIDL register, shown in Figure 2-35 and described in Table 2-47, contains information about the die
wafer number, and X, Y wafer coordinates.
Figure 2-35. Die Identification Register, Lower Word (DIEIDL) [offset = 7Ch]
31 24 23 16
WAFER # Y WAFER COORDINATE
R-D R-D
15 12 11 0
Y WAFER COORDINATE X WAFER COORDINATE
R-D R-D
LEGEND: R = Read only; D = value is device specific; -n = value after reset
Table 2-47. Die Identification Register, Lower Word (DIEIDL) Field Descriptions
Bit Field Description
31-24 WAFER # These read-only bits contain the wafer number of the device.
23-12 Y WAFER COORDINATE These read-only bits contain the Y wafer coordinate of the device.
11-0 X WAFER COORDINATE These read-only bits contain the X wafer coordinate of the device.
NOTE: Die Identification Information
The die identification information will vary from unit to unit. This information is programmed
by TI as part of the initial device test procedure.
2.5.1.29 Die Identification Register Upper Word (DIEIDH)
The DIEIDH register, shown in Figure 2-36 and described in Table 2-48, contains information about the
die lot number.
Figure 2-36. Die Identification Register, Upper Word (DIEIDH) [offset = 80h]
31 24 23 16
Reserved LOT #
R-0 R-D
15 0
LOT #
R-D
LEGEND: R = Read only; D = value is device specific; -n = value after reset
Table 2-48. Die Identification Register, Upper Word (DIEIDH) Field Descriptions
Bit Field Description
31-24 Reserved Reserved for TI use. Writes have no effect.
23-0 LOT # This read-only register contains the device lot number.
NOTE: Die Identification Information
The die identification information will vary from unit to unit. This information is programmed
by TI as part of the initial device test procedure.
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