NXP Semiconductors MPC5606S - Supported Instruction Codes in Winbond Devices

Quad Serial Peripheral Interface (QuadSPI)
MPC5606S Microcontroller Reference Manual, Rev. 7
Freescale Semiconductor 1065
30.7.1 Supported Instruction Codes in Winbond Devices
Table 30-52. Winbond Instruction Codes
Command
Instruction
Code
Required Input Data / Parameters Output Data
Options
QSPI_ICR[[ICO]
Address
[QSPI_SFAD]
Data
[TX Buffer]
Status / Data
[RX Buffer]
Write Enable 06h
Write Disable 04h
Read Status Reg1 05h size S7–S0 [8]
Read Status Reg2 35h size S15–S8 [8]
Write Status Reg 01h size S15–S0
Page Program 02h size A23–A0 [24] size × (D7 - D0)
1
Quad Page Program 32h size A23–A0 [24] size × (D7 - D0)
32k Block Erase 52h A23–A0 [24]
64k Block Erase D8h A23–A0 [24]
Sector Erase 20h A23–A0 [24]
Chip Erase C7h / 60h
Erase Suspend 75h
Erase Resume 7Ah
Power down B9h
High Performance mode A3h
Read Data 03h
2
size A23–A0 [24] size × (D7–D0)
1
Fast Read 0Bh size A23–A0 [24] size × (D7–D0)
Fast Read Dual Output 3Bh size A23–A0 [24] size × (D7–D0)
Fast Read Dual I/O BBh M7–M0, size A23–A0 [24] size × (D7–D0)
Fast Read Quad Output 6Bh size A23–A0 [24] size × (D7–D0)
Fast Read Quad I/O EBh M7–M0, size A23–A0 [24] size × (D7–D0)
Octal Word Read Quad I/O E3h M7–M0, size A23–A0 [24] size × (D7–D0)
(Continuous Read) mode Bit
Reset
FFh (FFh), size
Release
PowerDown/HighPerf.Mode
(optional): read device ID
ABh (opt.): read size (opt.): ID7– ID0
Read Manufacturer/Device ID 90h size A23–A0 [24] =
0h / 1h
ManID7–ManID0
, DevID7–Dev0