EMIF
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7.3 EMIF
7.3.1 Introduction
7.3.1.1 Features
The general features of the EMIF module are as follows:
• 16-bit data path to external SDRAM memory
• One 128-bit OCPIP 2.2 interface
• Support for the following memory types:
– mDDR (LPDDR1)
– DDR2
– DDR3
External memory configurations supported:
• Memory device capacity
– Up to 1G Byte addressability
• Flexible bank/row/column/chip-select address multiplexing schemes
• Device driver strength feature for mobile DDR supported
• Supports following CAS latencies:
– DDR2 => 2, 3, 4, 5, 6, and 7
– DDR3 => 5, 6, 7, 8, 9, 10, and 11
– mDDR => 2, 3, and 4
• Supports following number of internal banks:
– DDR2 => 1, 2, 4, and 8
– DDR3 => 1, 2, 4, and 8
– mDDR => 1, 2, and 4
• Supports 256, 512, 1024, and 2048-word page sizes
• Supports burst length of 8 (sequential burst)
• Write/read leveling/calibration and data eye training in conjunction with DID
• Self Refresh and Power-Down modes for low power:
– Flexible OCP to DDR address mapping to support Partial Array Self Refresh in LPDDR1, DDR2
and DDR3.
– Temperature Controlled Self Refresh for LPDDR1 and DDR3 having on-chip temperature sensor.
• Periodic ZQ calibration for DDR3
• ODT on DDR2 and DDR3
• Prioritized refresh scheduling
• Programmable SDRAM refresh rate and backlog counter
• Programmable SDRAM timing parameters
• Big and little endian modes
400
Memory Subsystem SPRUH73H–October 2011–Revised April 2013
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